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GB2D0021TPI-11/4" x 2" x 24" Grounding Busbar.
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Sub Brand | StructuredGround |
Material | Copper |
Overall Length (In.) | null |
Overall Length (mm) | null |
Overall Width (In.) | 2 |
Overall Width (mm) | 50.8 |
Overall Height (In.) | 2.75 |
Overall Height (mm) | 69.9 |
Stud Hole Size (In.) | 0.44 |
Stud Hole Size (mm) | 11.1 |
Finish/Coating | Tin-Plated |
Overall Thickness (In.) | null |
Overall Thickness (mm) | null |
Resistance Properties | NA |
Standards Met | BICSI/TIA-607-C, NEMA Hole Pattern, cULus |
Includes | NA |
Application | NA |
Product Type | Grounding Busbars |
Keywords | Busbars |
Part Features | Available with different hole pattern spacing including NEMA, BICSI and 1 inch, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation |
RoHS Compliancy Status | Compliant |
Min. Order Qty. | 1 |
UPC | 07498312355 |
Std. Pkg. Qty. | 1 |
Std. Pkg. Volume (cf) | 0.0069 |
Std. Ctn. Qty. | 0 |
Std. Ctn. Volume (cf) | 0.0000 |
Catalog Cut Sheets | Catalog Cut Sheet - GB4N0007TPI-1 Product Page | US English | 103 KB |
Catalog Cut Sheets | Catalog Cut Sheet - GB4N0007TPI-1 Product Page | US English | 90 KB |
Flyers | Telecommunications Bonding 5 Steps: D-GRFL02 | US English | 376 KB |
Flyers | Telecommunications Bonding 5 Steps: D-GRFL03 AUS | US English | 371 KB |
Part Drawings | "D" Pattern Grounding Busbars | US English | 138 KB |