Panduit Expands Its Data Center Portfolio with Scalable Direct-to-Chip Cooling Solutions for High-Density AI and HPC Environments

Direct-to-chip liquid cooling addresses the thermal limits of modern AI data centers

Frankfurt am Main, June 2026. The increasing adoption of artificial intelligence (AI), high-performance computing (HPC), and accelerated workloads is driving significantly higher power densities at both rack and chip level in data centers worldwide. Traditional air-based cooling concepts are increasingly reaching their physical and economic limits. With its FlexFusion™ direct-to-chip liquid cooling solutions, Panduit provides an integrated system specifically designed to meet these requirements, enabling efficient, space-saving, and scalable heat removal directly at the source.

Modern AI servers generate high thermal loads directly at the processors. Direct-to-chip (DTC) cooling removes this heat immediately from the chip, reducing reliance on room- or rack-based air cooling. This enables data center operators to realize higher rack densities within existing floor space while maintaining thermal stability.

The Panduit Direct-to-Chip Cooling System consists of FlexFusion DTC cooling racks and rack manifolds made of AISI 304 (V2A stainless steel), developed as coordinated system components. The racks feature adjustable E-rails, double-hinged doors, and electrically bonded steel frames and doors. They utilize previously unused space inside the rack, eliminating the need for additional add-on cabinets or rear expansions. This simplifies planning and reduces potential installation errors when integrating liquid-cooled servers.

The FlexFusion DTC rack manifolds, with a maximum supply pressure of 150 psi (10.34 bar), evenly distribute coolant to the liquid-cooled servers. The heated liquid (recommended: water with 25% propylene glycol) is then reliably returned to the cooling distribution unit (CDU) via 36 distribution couplings. Leak-free quick-connect couplings, automatic air vents, and flexible mounting options support fast, repeatable installation and low-maintenance operation in high-density data center environments.

Panduit’s direct-to-chip solutions are part of a comprehensive cooling portfolio and complement existing concepts such as rear door heat exchangers (RDHx). This enables operators to implement hybrid cooling architectures that accommodate both air- and liquid-cooled systems within a data center and can be adapted incrementally to increasing power requirements.

Panduit’s FlexFusion direct-to-chip cooling solutions are designed for use in AI and HPC clusters, enterprise and colocation data centers, as well as edge and on-premises deployments, helping operators consistently address the thermal, spatial, and infrastructure challenges of modern IT environments.