TINLEY PARK, Ill. — (November 20, 2019) — Panduit, a global leader in innovative electrical and network infrastructure solutions, will be showcasing IT/OT solutions at Rockwell Automation Fair in Chicago, IL on November 20-21, 2019. Go to the edge and take the leap with advanced industrial products and solutions that can be seen first-hand in booth #1229. Attendees can also visit the Panduit Single Pair Ethernet product feature in Rockwell’s Innovations booth.
The architecture needed to support the inclusion of smart devices, demand for enclosure density, and evolution of structured cabling puts pressure on organizations to have future-ready technology that enables security, safety, visibility, and agility. Panduit IT/OT solutions are engineered for all aspects of designing, installing and maintaining infrastructures within a variety of industrial environments. Booth #1229 is where you can see it to believe it.
Here’s what attendees can expect to see and hear about at Rockwell Automation Fair 2019:
Since 1955, Panduit’s culture of curiosity and passion for problem solving have enabled more meaningful connections between companies’ business goals and their marketplace success. Panduit creates leading-edge physical, electrical, network infrastructure and AV solutions for enterprise-wide environments, from the data center to the telecom room, from the desktop to the plant floor. Headquartered in Tinley Park, Ill., USA and operating in 112 global locations, Panduit’s proven reputation for quality and technology leadership, coupled with a robust partner ecosystem, help support, sustain, and empower business growth in a connected world.