{{(header.eyebrow.langSelector.label != '') ? header.eyebrow.langSelector.label : 'Choose Language'}}
{{ popupData.primarybody }}
{{ distyMobilePopUpData.title }}
{{ distyMobilePopUpData.primarybody }}
{{ distyMobilePopUpData.secondarybody }}
StructuredGround™ GB4B0612TPI-1 Telecom Grd Busbars, 0612, Copper, Tin-Plated
GB4B0612TPI-1
The GB4B0612TPI-1 Grounding Busbar meets BICSI and ANSI/TIA-607-D requirements for network systems grounding applications. Made of high conductivity copper and tin-plated to inhibit corrosion, comes pre-assembled with brackets and insulators attached for a quick installation. The insulators provide 600 V of insulation and use of Panduit self-laminating laser/ink jet labels to identify busbars.
Specifications
| Sub Brand | StructuredGround™ |
| Material | Copper |
| Overall Length (In.) | 12 |
| Overall Length (mm) | 304.8 |
| Overall Width (In.) | 4 |
| Overall Width (mm) | 101.6 |
| Overall Height (In.) | 2.75 |
| Overall Height (mm) | 69.9 |
| Stud Hole Size (In.) | 0.44 |
| Stud Hole Size (mm) | 11.17 |
| Finish/Coating | Tin-Plated |
| Overall Thickness (In.) | 0.25 |
| Overall Thickness (mm) | 6.4 |
| Standards Met | BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment |
| Application | Telecom/Data Center |
| Product Type | Grounding Busbar |
| Part Features | Available with a variety of hole pattern spacing options, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation |
Packaging Detail
| UPC | 07498334540 |
| Std. Pkg. Qty. | 1 |
| Std. Pkg. Volume (cf) | 0.0069 |
| Std. Ctn. Qty. | 0 |
| Std. Ctn. Volume (cf) | 0.0000 |
Resources
NOTE: Not all resources are available in your language.
If product info is not displayed in your selected language, it will be coming. We will continue to improve the experience over time.
Language
| Videos | 5 Steps to Implementing a Grounding and Bonding System Video | English | |
| Part Drawings | Grouding Busbar GB4B0612TPI-1 Part Drawing C41502 | English | |
| Application Notes | Telecommunications Bonding 5 Steps: D-GRFL03 AUS | English | |
| Articles | Article - Product Related - 08Jan CBM B-G strategies for telco room | English | |
| Articles | Article - Product Related - 06May CIM grounding and DC uptime | English | |
| Articles | Article - Product Related - 07Jun BISCI B-G design issues | English | |
| Articles | Article - Product Related - 07Nov CIM B-G shielded system | English | |
| Articles | Observations on Supplemental Grounding and Bonding Systems | English | |
| Articles | Article - Product Related - 08Sep ECM (WBU part 3-4) supp singlepoint B-G systems | English | |
| Catalogs | IEI Best Seller and Featured Parts Catalog ELCB34--SA-ENG | English | |
| Flyers | Telecommunications Bonding 5 Steps: D-GRFL02 | English | |
| Flyers | Tierras de Telecomunicaciones StructuredGround™ de Panduit Flyer GRFL02 | Spanish (Español) |
Frequently Bought Together
8 items
{{item.shortDescription}}
{{ item.partNumber }}
{{ getTranslation('panduit.productgroups.removeallitems') }}
