GB4B0624TPI-1

Telecommunications Grounding Busbars

1/4" x 4" x 20" Grounding Busbar.

Specifications

Material

Copper

Bar Width (In.)

4

Bar Width (mm)

101.6

Finish/Coating

Tin-Plated

Bar Thickness (In.)

0.25

Bar Thickness (mm)

6.4

Standards Met

BICSI/TIA-607-C, cULus

Length (In.)

20.00

Length (mm)

508.0

No. of 1/4" Stud Hole Sets, 5/8" Hole Spacing

24

No. of 3/8" Stud Hole Sets, 1" Hole Spacing

6

No. of 5/16" hole sets, 5/8" spacing

24

No. of 7/16" hole sets, 1" spacing

6

Overall Height (In.)

2.75

Overall Height (mm)

69.9

Overall Width (In.)

4.00

Overall Width (mm)

101.6

Part Features

Available with different hole pattern spacing including NEMA, BICSI and 1 inch, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation

Thickness (In.)

0.25

Thickness (mm)

6.4

RoHS Compliancy Status

Compliant

Min. Order Qty.

1

Packaging Details

UPC

07498334541

Std. Pkg. Qty.

1

Std. Pkg. Volume (cf)

0.6490

Std. Ctn. Qty.

0

Std. Ctn. Volume (cf)

0.0000

Resources

Part Drawings

Telecommunications Grounding Busbars - GB4B0624TPI-1 DXF

US English

Articles

Observations on Supplemental Grounding and Bonding Systems

US English

Articles

Bonding and Grounding Strategies for the Telecommunications Room

US English

Articles

Solutions to Grounding and Bonding

US English

Articles

Observations on Supplemental Grounding and Bonding Systems - Part 3-4

US English

Articles

Bonding a Shielded System

US English

Catalog Cut Sheets

GB2B0304TPI-1 Product Page

US English

Flyers

Telecommunications Bonding 5 Steps: D-GRFL02

US English

Part Drawings

GROUNDING BUSBAR (GB4B0624TPI)

US English

Catalogs

Preferred parts for network infrastructure

US English

Part Drawings

GB4B0624TPI-1 2D AutoCad

US English

Part Drawings

GB4B0624TPI-3D.Dwg

US English

Part Drawings

GB4B0624TPI-2D Dwg.

US English

Catalog Cut Sheets

GB2B0304TPI-1 Product Page

US English

Articles

Why Grounding is Critical to Data Center Uptime

US English

Flyers

Telecommunications Bonding 5 Steps: D-GRFL03 AUS

US English

Reference Architecture

Industrial Network Grounding and Bonding Configuration Drawing: PCD0011

US English

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