GB4B0624TPI-1

Telecommunications Grounding Busbars

1/4" x 4" x 20" Grounding Busbar.

Specifications

Material

Copper

Bar Width (In.)

4

Bar Width (mm)

101.6

Finish/Coating

Tin-Plated

Bar Thickness (In.)

0.25

Bar Thickness (mm)

6.4

Standards Met

BICSI/TIA-607-C, cULus

Length (In.)

20.00

Length (mm)

508.0

No. of 1/4" Stud Hole Sets, 5/8" Hole Spacing

24

No. of 3/8" Stud Hole Sets, 1" Hole Spacing

6

No. of 5/16" hole sets, 5/8" spacing

24

No. of 7/16" hole sets, 1" spacing

6

Overall Height (In.)

2.75

Overall Height (mm)

69.9

Overall Width (In.)

4.00

Overall Width (mm)

101.6

Part Features

Available with different hole pattern spacing including NEMA, BICSI and 1 inch, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation

Thickness (In.)

0.25

Thickness (mm)

6.4

RoHS Compliancy Status

Compliant

Min. Order Qty.

1

Packaging Details

UPC

07498334541

Std. Pkg. Qty.

1

Std. Pkg. Volume (cf)

0.6490

Std. Ctn. Qty.

0

Std. Ctn. Volume (cf)

0.0000

Resources

Part Drawings

GROUNDING BUSBAR (GB4B0624TPI)

US English

Catalogs

Preferred parts for network infrastructure

US English

Part Drawings

Telecommunications Grounding Busbars - GB4B0624TPI-1 DXF

US English

Articles

Solutions to Grounding and Bonding

US English

Articles

Observations on Supplemental Grounding and Bonding Systems - Part 3-4

US English

Articles

Bonding a Shielded System

US English

Articles

Observations on Supplemental Grounding and Bonding Systems

US English

Articles

Bonding and Grounding Strategies for the Telecommunications Room

US English

Catalog Cut Sheets

GB2B0304TPI-1 Product Page

US English

Flyers

Telecommunications Bonding 5 Steps: D-GRFL02

US English

Part Drawings

GB4B0624TPI-1 2D AutoCad

US English

Part Drawings

GB4B0624TPI-3D.Dwg

US English

Part Drawings

GB4B0624TPI-2D Dwg.

US English

Catalog Cut Sheets

GB2B0304TPI-1 Product Page

US English

Articles

Why Grounding is Critical to Data Center Uptime

US English

Flyers

Telecommunications Bonding 5 Steps: D-GRFL03 AUS

US English

Reference Architecture

Industrial Network Grounding and Bonding Configuration Drawing: PCD0011

US English

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