High Performance Computing (HPC) and AI workloads generate intense heat, while the addition of direct-to-chip manifolds and PDUs can create overcrowded, complex deployments that are difficult to scale and maintain. For organizations deploying AI infrastructure and high-performance computing environments, the Panduit Direct-to-Chip (DTC) Cooling Solution simplifies liquid cooling for AI and HPC servers with native integration, flexible mounting, and quick-swap components that accelerate deployment, improve serviceability, and support scalable growth.
Cool Smarter. Perform Better.
From deployment to ongoing operations, Panduit Direct-to-Chip Cooling helps you maximize space, accelerate implementation, de-risk growth, and future-proof your AI infrastructure.
Panduit Direct-to-Chip Solution Benefits
Maximize Rack Space
Optimize usable cabinet depth within a standard rack footprint.
Scalable Design
Supports up to 4 manifolds and 6 PDUs in a single cabinet.
Leak-Free Operation
Connect up to 56 server cooling loops per manifold with leak-free quick-disconnect fittings.
Quick Installation
The integrated cabinet and manifold design reduce installation time.
Simplify Serviceability
Quick-swap components streamline maintenance activities.
Global AI Infrastructure
Built for AI and HPC deployments worldwide with global standards compliance.
Product Highlights
Cooling Distribution Unit (CDU)
High-density AI deployments require precise, dependable cooling without adding unnecessary infrastructure complexity. The CDU supports efficient heat transfer between facility water and liquid-cooled servers, enabling scalable DTC cooling architectures. As a core part of the DTC cooling system, the CDU enables scalable liquid-cooling architectures while simplifying deployment, improving thermal management, and supporting dependable performance in demanding AI and HPC environments.
Direct-to-Chip Manifold
As rack densities increase, delivering coolant efficiently becomes more complex. The Panduit DTC Manifold simplifies liquid cooling by delivering coolant directly within the cabinet footprint. Unlike traditional approaches that add plumbing complexity, it maximizes space for compute, power, and cable management.
FlexFusionTM Cabinets
Space constraints shouldn't limit liquid-cooled AI deployments. The FlexFusion™ DTC Cooling Cabinet integrates cooling, power, and cable management within a standard rack footprint. Unlike traditional cabinets that require rear extensions or modifications, it enables a more efficient and scalable deployment.
Panduit EL2P Intelligent PDU
Modern AI infrastructure demands greater power visibility without increasing operational complexity. The EL2P™ Intelligent PDU combines simplified deployment, real-time monitoring, and enhanced security in a single platform. Unlike traditional PDUs, it helps improve uptime, streamline management, and deliver smarter power visibility across critical infrastructure.
Panduit Direct-to-Chip Cooling Solution Cabinet
Panduit Direct-to-Chip Cooling solution key features in 4000 lb dynamic cabinet application
- PDU
- Supply and Return Manifold
- CDU
Panduit Direct-to-Chip Solution Benefits
Scaling AI Infrastructure Without Operational Risk
As AI workloads push rack densities higher and accelerate global data center expansion, infrastructure decisions must balance performance with operational safety and reliability. Panduit applies deep engineering expertise and customer‑driven R&D to address the real‑world challenges of deploying advanced cooling and power infrastructure—especially in retrofit environments. Learn how Panduit’s approach helps data center operators, integrators, and enterprises scale AI confidently while maintaining uptime, serviceability, and long‑term efficiency.
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