PRESS RELEASE

Panduit Launches Direct-to-Chip Cooling System to Power the Future of AI Infrastructure

TINLEY PARK, Ill. — (Nov. 18, 2025) — Panduit, a leading global manufacturer of high-quality electrical and network infrastructure and connectivity solutions, today announced the launch of its Direct-to-Chip (DTC) Cooling System, an advancement in liquid cooling technology engineered for high-density AI and High Performance Computing environments. The Panduit DTC accelerates deployment, reduces installation risk, and delivers scalable thermal management within a standard cabinet footprint.

As AI workloads continue to push the boundaries of compute performance, data centers face mounting pressure to manage heat efficiently. DTC Cooling System addresses this challenge head-on, offering a future-ready solution that aligns with sustainability goals and operational efficiency.

“Our DTC Cooling System reflects Panduit’s commitment to solving real-world infrastructure challenges with smart, scalable solutions,” said David Weksel, Director of Strategic Growth of Panduit Ventures. “This launch marks a major step forward in enabling AI-ready environments that are efficient, reliable, and future-proof.”

Engineered for High-Density Compute

The DTC Cooling System includes FlexFusion™ cabinets and rack manifolds that work together to deliver uniform, leak-free liquid cooling directly to the chip. Key features include:

• Movable e-rails and split-hinged doors for simplified buildouts.
• Electrically bonded steel frames for structural integrity
• Quick-connect manifolds with automatic air exhaust valves for fast, error-free installation.
• Standard cabinet footprint—no rear extensions or retrofitting required.

This design enables data center operators to deploy high-density AI servers without compromising space, speed, or reliability.

Part of a Complete Cooling Portfolio

The DTC Cooling System complements Panduit’s existing Rear Door Heat Exchanger (RDHx) offering, creating a comprehensive liquid cooling strategy for modern data centers. Together, these solutions support scalable infrastructure across AI, HPC, and edge computing environments.

Availability

The Direct-to-Chip Cooling System is available now in the United States. To learn more, schedule a live demo, or explore technical specifications, visit: Panduit.com/dtc