GB2B0312TPI-1

Telecommunications Grounding Busbars

1/4" x 2" x 20" Grounding Busbar.

Specifications

Material

Copper

Bar Width (In.)

2

Bar Width (mm)

50.8

Finish/Coating

Tin-Plated

Bar Thickness (In.)

0.25

Bar Thickness (mm)

6.4

Standards Met

BICSI/TIA-607-C, cULus

Length (In.)

20.00

Length (mm)

508.0

No. of 3/8" Stud Hole Sets, 1" Hole Spacing

3

No. of 5/16" hole sets, 5/8" spacing

12

No. of 7/16" hole sets, 1" spacing

3

Overall Height (In.)

2.75

Overall Height (mm)

69.9

Overall Width (In.)

2.00

Overall Width (mm)

50.8

Part Features

Available with different hole pattern spacing including NEMA, BICSI and 1 inch, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation

Thickness (In.)

0.25

Thickness (mm)

6.4

RoHS Compliancy Status

Compliant

Min. Order Qty.

1

Packaging Details

UPC

07498365929

Std. Pkg. Qty.

1

Std. Pkg. Volume (cf)

0.6490

Std. Ctn. Qty.

0

Std. Ctn. Volume (cf)

0.0000

Resources

Catalog Cut Sheets

GB2B0304TPI-1 Product Page

US English

Part Drawings

GB2B0312TPI-2D Dwg.

US English

Catalog Cut Sheets

US English

Articles

US English

Articles

US English

Articles

US English

Articles

US English

Specification Sheets

StructuredGround Tele Rm Grounding and Bonding Kits for TIA-607-C Compliance

US English

Specification Sheets

StructuredGround™ Grounding Auxiliary Cable Brackets and Jumpers Spec Sheet

US English

Part Drawings

Telecommunications Grounding Busbars - GB2B0312TPI

US English

Part Drawings

GB2B0312TPI-1 2D AutoCad

US English

Part Drawings

GB2B0312TPI-3D.Dwg

US English

Flyers

Telecommunications Bonding 5 Steps: D-GRFL02

US English

Flyers

Telecommunications Bonding 5 Steps: D-GRFL03 AUS

US English

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