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StructuredGround™ GB4B1028TPI-1 Telecom Grd Busbars, 1028, Copper, Tin-Plated
GB4B1028TPI-1
The GB4B1028TPI-1 Grounding Busbar meets BICSI and ANSI/TIA-607-D requirements for network systems grounding applications. Made of high conductivity copper and tin-plated to inhibit corrosion, comes pre-assembled with brackets and insulators attached for a quick installation. The insulators provide 600 V of insulation and use of Panduit self-laminating laser/ink jet labels to identify busbars.
Specifications
| Sub Brand | StructuredGround™ |
| Material | Copper |
| Overall Length (In.) | 24 |
| Overall Length (mm) | 609.6 |
| Overall Width (In.) | 4 |
| Overall Width (mm) | 101.6 |
| Overall Height (In.) | 2.75 |
| Overall Height (mm) | 69.9 |
| Stud Hole Size (In.) | 0.31 |
| Stud Hole Size (mm) | 7.87 |
| Finish/Coating | Tin-Plated |
| Overall Thickness (In.) | 0.25 |
| Overall Thickness (mm) | 6.4 |
| Standards Met | BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment |
| Application | Telecom/Data Center |
| Product Type | Grounding Busbar |
| Part Features | Available with a variety of hole pattern spacing options, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation |
Packaging Detail
| UPC | 07498312560 |
| Std. Pkg. Qty. | 1 |
| Std. Pkg. Volume (cf) | 0.0135 |
| Std. Ctn. Qty. | 0 |
| Std. Ctn. Volume (cf) | 0.0000 |
Resources
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Language
| Videos | 5 Steps to Implementing a Grounding and Bonding System Video | English | |
| Part Drawings | Grouding Busbar GB4B1028TPI-1 Part Drawing C41768 | English | |
| Application Notes | Telecommunications Bonding 5 Steps: D-GRFL03 AUS | English | |
| Catalogs | IEI Best Seller and Featured Parts Catalog ELCB34--SA-ENG | English | |
| Flyers | Telecommunications Bonding 5 Steps: D-GRFL02 | English | |
| Flyers | Tierras de Telecomunicaciones StructuredGround™ de Panduit Flyer GRFL02 | Spanish (Español) |
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